3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 9000 | PCS | 217102.72 | TAIWAN | DELHI AIR |
3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 4500 | PCS | 108551.36 | TAIWAN | DELHI AIR |
3/31/2024 | 85423200 | 1107-002918 IC-UNIVERSAL FLASH STORAGE THGJFJT2T85BA (IC MEMORY FOR SAMSUNG MANUFACTURING) | XXXXXXXXXX | 7500 | PCS | 180918.94 | TAIWAN | DELHI AIR |
3/30/2024 | 85423200 | [335S00552][INTEGRATED CIRCUIT MEMORY,NAND,BC5T,256GB,S5E,11.0,512G,K,ULG (INTEGRATED CIRCUIT MEMORY)](PARTS FOR USE IN | XXXXXXXXXX | 771 | NOS | 15927 | TAIWAN | CHENNAI AIR |
3/30/2024 | 85423200 | IC-Memory WINBOND IC W25Q82DVUXIET (335S00644) | XXXXXXXXXX | 256000 | NOS | 32166.65 | TAIWAN | BANGALORE AIR |
3/30/2024 | 85423200 | [335S00504][INTEGRATED CIRCUIT MEMORY,NAND,3D6T,256GB,S5E,XX.X,512G,H,LGA (INTEGRATED CIRCUIT MEMORY)](PARTS FOR USE IN | XXXXXXXXXX | 5559 | NOS | 114835.56 | TAIWAN | CHENNAI AIR |
3/30/2024 | 85423200 | 1267379568 MX25L25639FXDQ IC PACKAGE | XXXXXXXXXX | 2000 | NOS | 4249.07 | TAIWAN | BANGALORE AIR |
3/30/2024 | 85423200 | 1267379568 MX25L25639FXDQ IC PACKAGE | XXXXXXXXXX | 2000 | NOS | 4249.07 | TAIWAN | BANGALORE AIR |
3/30/2024 | 85423200 | IC-Memory WINBOND IC W25Q82DVUXIET (335S00644) | XXXXXXXXXX | 160000 | NOS | 20104.16 | TAIWAN | BANGALORE AIR |
3/29/2024 | 85423200 | 9120404 INTEGRATED CIRCUIT (MEMORY) (USE IN MFG OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 28000 | NOS | 204895.66 | TAIWAN | DELHI AIR |