3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L, (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 10800 | PCS | 21865.93 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L, (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 9000 | PCS | 18270.38 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L, (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 16200 | PCS | 32735.47 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L(UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 9000 | PCS | 18270.38 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L, (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 12600 | PCS | 25491.07 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L, (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 8100 | PCS | 16472.61 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06102A PCB MAIN-SM-M156B SM-M156B,CCL,PPG,COPPE (UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 21600 | PCS | 29421.66 | Vietnam | DELHI AIR |
3/31/2024 | 85340000 | GH41-06096A PCB MAIN-SM-A556B/E/0 SM-A556B,FR-4,10L,(UNMOUNTED PCB FOR MANUFACTURING OF MOBILE PHONE) | SAMSUNG ELECTRONICS JAPAN CO | 51300 | PCS | 103682.41 | Vietnam | DELHI AIR |
3/30/2024 | 85340000 | TSIN8813 IMXRT1176 SMARC SOM 10 LAYERS (BARE PRINTED CIRCUITBOARDS) | Vector Fabrication (Viet Nam ) Co Ltd | 8 | NOS | 1545.03 | Vietnam | BANGALORE AIR |
3/30/2024 | 85340000 | GH94-36304A ASSY SMD INTERPOSER-SM-F946 SM-F946,WW (UNMOUNTED PCB FOR MANUFACTURING OF FLIP/FOLD MOBILE PHONE) | SAMSUNG ELECTRONICS VIETNAM CO | 510 | PCS | 524.61 | Vietnam | DELHI AIR |