12/20/2023 | 85340000 | 26 LAYER P.C.BARE BOARD WITH EPOXY RESIN FIBERGLASS- PART NO -EPC-OFMH14/K-SE2 -( FOR R & D PURPOSE ) 85 | XXXXXXXXXX | 10 | PCS | 3848.29 | TAIWAN | DELHI ACC |
12/20/2023 | 85340000 | 26 LAYER P.C.BARE BOARD WITH EPOXY RESIN FIBERGLASS- PART NO -EPC-OFMH14/K-SE2 -( FOR R & D PURPOSE ) 85 | XXXXXXXXXX | 1 | PCS | 434.88 | TAIWAN | DELHI ACC |
12/16/2023 | 85340000 | GH41-05985A PCB MAIN-MAIN_SM-S918B SM-S918B,FR-4,10L (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 2400 | PCS | 5332.69 | TAIWAN | DELHI ACC |
12/16/2023 | 85340000 | GH41-05908A PCB MAIN-SM-A336B SM-A336B,FR-4,10L,T0.6 (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 390 | PCS | 915.67 | TAIWAN | DELHI ACC |
12/16/2023 | 85340000 | GH41-05908A PCB MAIN-SM-A336B SM-A336B,FR-4,10L,T0.6 (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 1392 | PCS | 3268.23 | TAIWAN | DELHI ACC |
12/11/2023 | 85340000 | HA112831-7100 PCB 85 | XXXXXXXXXX | 36864 | PCS | 58618.21 | TAIWAN | DELHI ACC |
12/9/2023 | 85340000 | GH41-05908A PCB MAIN-SM-A336B SM-A336B,FR-4,10L,T0.6 (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 918 | PCS | 2152.73 | TAIWAN | DELHI ACC |
12/9/2023 | 85340000 | GH41-05908A PCB MAIN-SM-A336B SM-A336B,FR-4,10L,T0.6 (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 144 | PCS | 337.68 | TAIWAN | DELHI ACC |
12/9/2023 | 85340000 | GH41-05985A PCB MAIN-MAIN_SM-S918B SM-S918B,FR-4,10L (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 2400 | PCS | 5427.61 | TAIWAN | DELHI ACC |
12/9/2023 | 85340000 | GH41-05908A PCB MAIN-SM-A336B SM-A336B,FR-4,10L,T0.6 (UNMOUNTED PCB FOR SAMSUNG MANUFACTURING) 85 | XXXXXXXXXX | 1284 | PCS | 3011.01 | TAIWAN | DELHI ACC |