1/30/2024 | 84807100 | INJECTION MOLD FOR CASE VEG-LOW (DA61-13189A002) (ACTUAL USER) USD | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 61612.08 | South Korea | N/A |
1/30/2024 | 84807100 | EPS MOLD FOR CUSHION BOTTOM (DA69-02507A002) (ACTUAL USER) USD | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 25273.07 | South Korea | N/A |
1/30/2024 | 84807100 | 2+2 CAVITY W610 LENS TOOL BSD USD | KISANTECH | 1 | PCS | 28654.05 | South Korea | N/A |
1/30/2024 | 84807100 | EPS MOLD FOR CUSHION CORNER-FRONT (DA69-01678A008) (ACTUAL USER) USD | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 22759.09 | South Korea | N/A |
1/30/2024 | 84807100 | MOLD FOR GEN2 ROTOR OS(1 SET) (ACTUAL USER) USD | HYUNDAI POLYTECH CO LIMITED | 1 | PCS | 75591.25 | south korea | N/A |
1/28/2024 | 84807100 | COVER-REAR [INJECTION MOLD] (BN63-21274A001)(ACTUAL USER) INR | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 130740.47 | South Korea | N/A |
1/28/2024 | 84807100 | PUNCHING MOLDS USD | FUTURE PACK CO LIMITED | 6 | SET | 39820.07 | south korea | N/A |
1/28/2024 | 84807100 | 300 ML ADDITIONAL CUP FORMING MOLD WITH ACCESSORIES USD | FUTURE PACK CO LIMITED | 1 | SET | 8168.22 | south korea | N/A |
1/28/2024 | 84807100 | COVER-REAR [INJECTION MOLD] (BN63-21275A001)(ACTUAL USER) INR | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 152661.02 | South Korea | N/A |
1/28/2024 | 84807100 | COVER-REAR [INJECTION MOLD] (BN63-21276A001)(ACTUAL USER) INR | SAMSUNG ELECTRONICS CO LTD | 1 | PCS | 143001.81 | South Korea | N/A |