3/30/2024 | 74198090 | LEADFRAMES-16L 96X130 FUSE QSOP DUAL ETCHED(ANNEXURE-III SLNO.319) | XXXXXXXXXX | 45000 | NOS | 2483.64 | HONG KONG | CHENNAI AIR |
3/30/2024 | 74198090 | LEADFRAMES-12L 1.4X5.1 TDLMP (2.0X6.0) ETCHED(ANNEXURE-IIISL NO.319) | XXXXXXXXXX | 393 | NOS | 2359.75 | HONG KONG | CHENNAI AIR |
3/30/2024 | 74198090 | LEADFRAMES-2L 1.6X1.6MM TDLMP 3.4X2.2 ETCHED(ANNEXURE-IIISL NO.319) | XXXXXXXXXX | 5000 | NOS | 23282.61 | HONG KONG | CHENNAI AIR |
3/30/2024 | 74198090 | LEADFRAMES-48L 5.8X5.8MM TQLMP 7.0X7.0 ETCHED(ANNEXURE-IIISL NO.319) | XXXXXXXXXX | 710 | NOS | 4906.99 | HONG KONG | CHENNAI AIR |
3/29/2024 | 74198090 | GH83-09439A JDM-PCB CU FOIL_WI SM-X210,715001024101, (COPPERFOIL FOR MANUFACTURING OF TABLET) | XXXXXXXXXX | 1950 | PCS | 55.37 | HONG KONG | DELHI AIR |
3/29/2024 | 74198090 | GH83-09439A JDM-PCB CU FOIL_WI SM-X210,715001024101, (COPPERFOIL FOR MANUFACTURING OF TABLET) | XXXXXXXXXX | 50 | PCS | 1.42 | HONG KONG | DELHI AIR |
3/21/2024 | 74198090 | GH83-09112A JDM-CU FOIL 2 SM-A055F,715001019181,7150 (COPPERFOIL FOR MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 4500 | PCS | 13.72 | HONG KONG | DELHI AIR |
3/21/2024 | 74198090 | GH83-09111A JDM-CU FOIL 1 SM-A055F,715001019011,7150 (COPPERFOIL FOR MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 10000 | PCS | 108.91 | HONG KONG | DELHI AIR |
3/21/2024 | 74198090 | GH83-09380A JDM-PCB CU FOIL_5G SM-X216B,715001024091 (COPPERFOIL FOR MANUFACTURING OF TABLET) | XXXXXXXXXX | 2000 | PCS | 65.76 | HONG KONG | DELHI AIR |
3/21/2024 | 74198090 | GH83-09112A JDM-CU FOIL 2 SM-A055F,715001019181,7150 (COPPERFOIL FOR MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 5500 | PCS | 16.77 | HONG KONG | DELHI AIR |