3/24/2024 | 74101100 | 046986-RF Copper foil, 0.025mm (0.001in) thick, annealed, uncoated, 99.8% (metals basis) | XXXXXXXXXX | 18 | MTR | 16.34 | USA | HYDERABAD AIR |
2/26/2024 | 74101100 | 042189-FI Copper foil 0.1mm (0.004in) thick Puratronic 99.999% (metals basis) | XXXXXXXXXX | 2.5 | MTR | 26.72 | USA | HYDERABAD AIR INHYD4 |
2/9/2024 | 74101100 | CARBON COATED COPPER FOILWIDTH:230MM | XXXXXXXXXX | 340.9 | KGS | 8044.11 | CHINA | HYDERABAD AIR INHYD4 |
2/6/2024 | 74101100 | 010950-GZ Copper foil 0.025mm (0.001in) thick Puratronic99.999% (metals basis) | XXXXXXXXXX | 25 | MTR | 61.57 | USA | HYDERABAD AIR INHYD4 |
2/1/2024 | 74101100 | 046986-RG Copper foil 0.025mm (0.001in) thick annealed uncoated 99.8% (metals basis) | XXXXXXXXXX | 90 | MTR | 91.1 | USA | HYDERABAD AIR INHYD4 |
2/1/2024 | 74101100 | 010950-GZ Copper foil 0.025mm (0.001in) thick Puratronic99.999% (metals basis) | XXXXXXXXXX | 25 | MTR | 61.68 | USA | HYDERABAD AIR INHYD4 |
2/1/2024 | 74101100 | 035818-FF Copper foil 0.05mm (0.002in) thick annealed 99.8% (metals basis) | XXXXXXXXXX | 0.625 | MTR | 0.91 | USA | HYDERABAD AIR INHYD4 |
12/30/2023 | 74101100 | ES948D71409 LC5470AA000577+Thermal copper foil COPPER FOIL (PARTS FOR MANUFACTURING OF MOBILE PHONE) 74 | XXXXXXXXXX | 7000 | NOS | 297.39 | CHINA | DELHI ACC |
12/30/2023 | 74101100 | SH48D66482 ZEEKR COPPER PCB BACK (COPPER PART) (FOR MANUFACTURING OF MOTOROLA MOBILE PHONE) 74 | XXXXXXXXXX | 10 | NOS | 0.33 | CHINA | DELHI ACC |
12/30/2023 | 74101100 | SH48D66948 ZEEKR COPPER BLOCK CPU (COPPER PART) (FOR MANUFACTURING OF MOTOROLA MOBILE PHONE) 74 | XXXXXXXXXX | 10 | NOS | 1.15 | CHINA | DELHI ACC |