3/21/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(P/N:VSSR1601472JTF)ANNEXURE-III SL NO.314) | XXXXXXXXXX | 14232 | NOS | 756.5 | USA | CHENNAI AIR |
3/16/2024 | 38180090 | HMT868.2 IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-IIISL NO.312) | XXXXXXXXXX | 21 | NOS | 32246.35 | SWITZERLAND | CHENNAI AIR |
3/14/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.306) | XXXXXXXXXX | 72387 | NOS | 3650.74 | USA | CHENNAI AIR |
3/14/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.309) | XXXXXXXXXX | 4606 | NOS | 8715.79 | USA | CHENNAI AIR |
3/11/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.305) | XXXXXXXXXX | 85039 | NOS | 8577.64 | USA | CHENNAI AIR |
3/9/2024 | 38180090 | HMT868.2 IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-IIISL NO.307) | XXXXXXXXXX | 25 | NOS | 38388.51 | SWITZERLAND | CHENNAI AIR |
3/8/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.303) | XXXXXXXXXX | 53938 | NOS | 16865.78 | USA | CHENNAI AIR |
3/8/2024 | 38180090 | BOROFLOAT 33 SCHOTT WAFERS,DIAMETER:4-IN (100 + 0.5MM)THICKNESS:500+250UM, AS PER PO | XXXXXXXXXX | 200 | NOS | 5668.73 | USA | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-022290089-H0)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3266 | NOS | 1141.03 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N: O-042290385-E1)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3195 | NOS | 1116.23 | GERMANY | CHENNAI AIR |