7/10/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(MTF#A089044)ANNEXURE-III SL NO.131 | XXXXXXXXXX | 167340 | NOS | 12864.91 | MALAYSIA | CHENNAI AIR CARGO ACC |
7/6/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(C0UG6403/C0UG64.03)ANNEXURE-III NO SL NO.124) | XXXXXXXXXX | 66936 | NOS | 5133.6 | MALAYSIA | CHENNAI AIR CARGO ACC |
7/6/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(C0UG6408/C0UG64.08)ANNEXURE-III NO SL NO.124) | XXXXXXXXXX | 66936 | NOS | 5133.6 | MALAYSIA | CHENNAI AIR CARGO ACC |
7/6/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(C0XH9700/C0XH97.00)ANNEXURE-III NO SL NO.124) | XXXXXXXXXX | 44624 | NOS | 3422.4 | MALAYSIA | CHENNAI AIR CARGO ACC |
7/6/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(C0QF8200/C0QF82.00)ANNEXURE-III NO SL NO.124) | XXXXXXXXXX | 44624 | NOS | 3422.4 | MALAYSIA | CHENNAI AIR CARGO ACC |
5/22/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER P/N.4XVH245Z5 DMG80 C(ANNEXURE-III SL NO.079) | XXXXXXXXXX | 278900 | NOS | 21423.12 | MALAYSIA | CHENNAI AIR CARGO ACC |
5/22/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER P/N.4XVH245Z5 DMG80 C(ANNEXURE-III SL NO.079) | XXXXXXXXXX | 145028 | NOS | 11140.02 | MALAYSIA | CHENNAI AIR CARGO ACC |
5/22/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER P/N.4XVH245Z5 DMG80 C(ANNEXURE-III SL NO.079) | XXXXXXXXXX | 111560 | NOS | 8569.25 | MALAYSIA | CHENNAI AIR CARGO ACC |
5/22/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER P/N.4XVH245Z5 DMG80 C(ANNEXURE-III SL NO.079) | XXXXXXXXXX | 278900 | NOS | 21423.12 | MALAYSIA | CHENNAI AIR CARGO ACC |
4/17/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFERS(L/N.SI00650PY P/N4XVH2245Z5 DMG80 C)ANNEXURE-III SL NO.015 | XXXXXXXXXX | 78092 | NOS | 5992.28 | MALAYSIA | CHENNAI AIR CARGO ACC |