11/24/2023 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(DIE MLS 1000 150MM UNDICED)LOT NO.678816 ANNEXURE-III SL NO.231 | XXXXXXXXXX | 3071 | NOS | 2624.02 | GERMANY | CHENNAI AIR CARGO ACC |
11/23/2023 | 38180090 | ZSC31150GAB ASIC DIE (COMPENENT USED FOR PRESSURE TRANSMITE) | XXXXXXXXXX | 34245 | NOS | 53155.33 | GERMANY | BANGALORE ACC |
10/19/2023 | 38180090 | 647675-1EA SILICON WAFER (100) DOPED (P-TYPE) 2 [3.5G X 1NO] | XXXXXXXXXX | 1 | NOS | 77.09 | GERMANY | BANGALORE ACC |
7/1/2023 | 38180090 | ASIC DIE ZSC31150GAB(COMPENENT USED FOR PRESSURE TRANSMITE)(ITEM DESCP.& QTY AS PER INVOICE) | XXXXXXXXXX | 42869 | PCS | 66782.96 | GERMANY | BANGALORE ACC |
4/26/2023 | 38180090 | ASIC DIE ZSC31150GAB(COMPENENT USED FOR PRESSURE TRANSMITE)(ITEM DESCP.& QTY AS PER INVOICE) | XXXXXXXXXX | 42382 | PCS | 67060.31 | GERMANY | BANGALORE ACC |
4/15/2023 | 38180090 | PRIME SIT WET SIO2 WAFER INCH THICKNESS | XXXXXXXXXX | 5 | NOS | 514.81 | GERMANY | BANGALORE ACC |