3/21/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(P/N:VSSR1601472JTF)ANNEXURE-III SL NO.314) | XXXXXXXXXX | 14232 | NOS | 756.5 | USA | CHENNAI AIR |
3/14/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.306) | XXXXXXXXXX | 72387 | NOS | 3650.74 | USA | CHENNAI AIR |
3/14/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.309) | XXXXXXXXXX | 4606 | NOS | 8715.79 | USA | CHENNAI AIR |
3/11/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.305) | XXXXXXXXXX | 85039 | NOS | 8577.64 | USA | CHENNAI AIR |
3/8/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.303) | XXXXXXXXXX | 53938 | NOS | 16865.78 | USA | CHENNAI AIR |
3/8/2024 | 38180090 | BOROFLOAT 33 SCHOTT WAFERS,DIAMETER:4-IN (100 + 0.5MM)THICKNESS:500+250UM, AS PER PO | XXXXXXXXXX | 200 | NOS | 5668.73 | USA | CHENNAI AIR |
3/4/2024 | 38180090 | DEI1270A-MES-G(LOT#ZZ905A) IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.302) | XXXXXXXXXX | 1874 | NOS | 321.92 | USA | CHENNAI AIR |
2/14/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.292) | XXXXXXXXXX | 26396 | NOS | 2673.03 | USA | CHENNAI AIR CARGO |
2/12/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(P/N.VTSR111-186-1001TF)ANNEXURE-III SL NO.286 | XXXXXXXXXX | 5730 | NOS | 760.14 | USA | CHENNAI AIR CARGO |
2/12/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(P/N.VTSR111-186-1001TF)ANNEXURE-III SL NO.286 | XXXXXXXXXX | 8660 | NOS | 1157.6 | USA | CHENNAI AIR CARGO |