3/27/2024 | 38180090 | ZSC31150GAB ASIC DIE (COMPENENT USED FOR PRESSURE TRANSMITE) | XXXXXXXXXX | 28232 | NOS | 43910.22 | GERMANY | BANGALORE AIR |
3/11/2024 | 38180010 | SILICON WAFER (FREE SAMPLE) | XXXXXXXXXX | 102 | NOS | 208.83 | GERMANY | AHEMDABAD AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-022290089-H0)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3266 | NOS | 1141.03 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N: O-042290385-E1)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3195 | NOS | 1116.23 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-022290088-E5)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3179 | NOS | 1110.64 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-022290252-B3)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3227 | NOS | 1127.41 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-042290418-A6)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3238 | NOS | 1131.25 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N: O-042290173-A7)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3305 | NOS | 1154.66 | GERMANY | CHENNAI AIR |
3/7/2024 | 38180090 | IC CHIPS IN THE FORM OF SILICON WAFER(W/N:O-042290378-H0)ANNEXURE-III SL NO.300) | XXXXXXXXXX | 3064 | NOS | 1070.46 | GERMANY | CHENNAI AIR |
3/1/2024 | 38180090 | ZSC31150GAB ASIC DIE (COMPENENT USED FOR PRESSURE TRANSMITE) | XXXXXXXXXX | 30800 | NOS | 47825.07 | GERMANY | BANGALORE AIR |