12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | Denso Ten Limited | 12 | KGS | 482.23 | JAPAN | DELHI ACC |
12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | Denso Ten Limited | 12 | KGS | 482.23 | JAPAN | DELHI ACC |
12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | Denso Ten Limited | 4 | KGS | 160.74 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.03 SOLDER PASTE, SE48-M956-2 (500G/JAR) 38 | KOKI COMPANY LIMITED | 12 | PCS | 210.6 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.05 SOLDER PASTE, SE4-M951DK (20G/S3) 38 | KOKI COMPANY LIMITED | 2 | PCS | 19.01 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.01 SOLDER PASTE, S3X58-M500 (500G/CART) 38 | KOKI COMPANY LIMITED | 800 | PCS | 27787.55 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.04 SOLDER PASTE, SS48-M956-2 (500G/JAR) 38 | KOKI COMPANY LIMITED | 20 | PCS | 489.94 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.01 SOLDER PASTE, S3X70-M500 (500G/JAR) 38 | KOKI COMPANY LIMITED | 60 | PCS | 2127.94 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.01 SOLDER PASTE, S3X58-M500 (500G/CART) 38 | KOKI COMPANY LIMITED | 340 | PCS | 11809.71 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.01 SOLDER PASTE, SS58-M955LV (500G/JAR) 38 | KOKI COMPANY LIMITED | 10 | PCS | 244.97 | JAPAN | DELHI ACC |