12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | XXXXXXXXXX | 4 | KGS | 160.74 | JAPAN | DELHI ACC |
12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | XXXXXXXXXX | 12 | KGS | 482.23 | JAPAN | DELHI ACC |
12/29/2023 | 38101090 | HUMISEAL 1B51 (056101-10070700) (FOR MOISTURE PROOFING & INSULATING PCB) (FOR USE IN MFG OF CAR AUDIO SYSTEM) (CAP. USE) 38 | XXXXXXXXXX | 12 | KGS | 482.23 | JAPAN | DELHI ACC |
12/28/2023 | 38101010 | L90200L319 SOLDER PASTE M731-GWS-T7K 550G SYRINGE TYPE (CAPTIVE CONSUMPTION) 38 | XXXXXXXXXX | 20 | PCS | 1754.83 | JAPAN | DELHI ACC |
12/20/2023 | 38101010 | BRAZING MATERIAL (TB-5000) (100G) (50121150) 38 | XXXXXXXXXX | 5 | PCS | 2088.25 | JAPAN | DELHI ACC |
12/19/2023 | 38101010 | TAMURA SOLDER PASTE TLF-286-19ACa ( FOR SOLDERING PURPOSE) 38 | XXXXXXXXXX | 20 | KGS | 2981.49 | JAPAN | DELHI ACC |
12/16/2023 | 38101010 | ALMIT BRAND SOLDER PASTE SN63 HM1-RMA V14L 9.5% 500G/JAR (SAMPLE) (FOC) 38 | XXXXXXXXXX | 1 | KGS | 76.14 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.04 SOLDER PASTE, SS48-M956-2 (500G/JAR) 38 | XXXXXXXXXX | 20 | PCS | 489.94 | JAPAN | DELHI ACC |
12/14/2023 | 38101010 | SOLDER PASTE PS10B-600A-ANI-1 P/N 070313503 DNIN (CAPTIVE CONSUMPTION) 38 | XXXXXXXXXX | 160 | KGS | 14432.56 | JAPAN | DELHI ACC |
12/14/2023 | 38101090 | L.05 SOLDER PASTE, SE4-M951DK (20G/S3) 38 | XXXXXXXXXX | 2 | PCS | 19.01 | JAPAN | DELHI ACC |