3/31/2024 | 38109090 | SOLDER PASTE 500G T4 DURAFUSE INDIUM/INDIUM10.8HF(1G03-00500AC\\\\\) SOLDER PASTE | PEGATRON CORPORATION | 841 | GMS | 340.13 | CHINA | CHENNAI AIR |
3/31/2024 | 38109090 | SOLDER PASTE 500G T4 DURAFUSE INDIUM/INDIUM10.8HF(1G03-00500AC\\\\\) | PEGATRON CORPORATION | 35 | GMS | 14.18 | CHINA | CHENNAI AIR |
3/30/2024 | 38109090 | SOLDER-CREAM;PFM-48W LT-SH,D20~38um,96.5(0202-001830) | SAMSUNG ELECTRONICS CO., LTD. | 20000 | GMS | 1589.45 | South Korea | CHENNAI AIR |
3/30/2024 | 38109090 | SOLDER-CREAM;PFM-48W LT-SH,D20~38um,96.5(0202-001830) | SAMSUNG ELECTRONICS CO., LTD. | 20000 | GMS | 1589.45 | South Korea | CHENNAI AIR |
3/30/2024 | 38101090 | [0603011-001S0065][SENJU SOLDER BALL] (FOR MFG OF MOBILE UNIT) | LU MEI INTERNATIONAL CO LIMITED | 20000000 | PCS | 3459.95 | JAPAN | CHENNAI AIR |
3/30/2024 | 38109090 | SOLDER-CREAM;PFM-48W LT-SH,D20~38um,96.5(0202-001830) | SAMSUNG ELECTRONICS CO., LTD. | 20000 | GMS | 1527.95 | South Korea | CHENNAI AIR |
3/30/2024 | 38101090 | 910-SMD291SNL10T5 CHIP QUIK SODR PASTE LF(T5)S/SOLDER | MOUSER ELECTRONICS INC | 2 | NOS | 70.53 | CHINA | BANGALORE AIR |
3/30/2024 | 38109090 | SOLDER-CREAM;PFM-48W LT-SH,D20~38um,96.5(0202-001830) | SAMSUNG ELECTRONICS CO., LTD. | 60000 | GMS | 4583.85 | South Korea | CHENNAI AIR |
3/30/2024 | 38109090 | SOLDER-CREAM;PFM-48W LT-SH,D20~38um,96.5(0202-001830) | SAMSUNG ELECTRONICS CO., LTD. | 60000 | GMS | 4583.85 | South Korea | CHENNAI AIR |
3/30/2024 | 38101010 | SOLDER PASTE S70G-HF(CM)TYPE5 (FOR USE IN MOBILE INDUSTRY) QTY: 200 KGS | ROLIAN INDUSTRY CO LIMITED | 200 | KGS | 18817.29 | CHINA | CHENNAI AIR |