3/30/2024 | 84733010 | CARD ASM, ADP, O/T MAINBOARD , W/CPU, O/T LAPTOP, APP<=70.0 WT 001877 SE SBC BRD2RA272 US | XXXXXXXXXX | 1 | PCS | 5515.41 | HONG KONG | BANGALORE AIR |
3/29/2024 | 85423100 | IC(MAIN CHIP)-MSES10CE-MSES10CE | XXXXXXXXXX | 1295 | PCS | 3886.99 | HONG KONG | DELHI AIR |
3/22/2024 | 85423900 | MIFARE NFC CHIP PN5321A3HN/C106,55 QFN-40- NXP - PN5321A3HN/C106,55,NXP - ICS | XXXXXXXXXX | 4900 | NOS | 13162.67 | HONG KONG | CHENNAI AIR |
3/22/2024 | 85423900 | MIFARE NFC CHIP PN5321A3HN/C106,55 QFN-40- NXP - PN5321A3HN/C106,55,NXP -ICS | XXXXXXXXXX | 2450 | NOS | 6581.33 | HONG KONG | CHENNAI AIR |
3/21/2024 | 19053100 | PARLE HIDE & SEEK CHOCO CHIP COOKIES(DTLS.ASPER INV.)WE CLM.RODTEP SCHEME | XXXXXXXXXX | 18 | PCS | 26.12 | HONG KONG | KOLKATA SEA |
3/19/2024 | 84733010 | AMD 9474F CPU:- 100-000000788 AMD 9474F3.60 GHZ 48-CORE PROCESSOR (COUNTRY OFORIGIN :- MALAYSIA) | XXXXXXXXXX | 36 | NOS | 78217.51 | HONG KONG | SAHAR AIR |
3/15/2024 | 39269099 | (HW/MB)CPU THERMAL SILICA,10*10*0.6MM_GR | XXXXXXXXXX | 3120 | PCS | 41.53 | HONG KONG | CMA CGM LOGISTICS PARK ICD |
3/15/2024 | 39269099 | (HW/MB)CPU THERMAL SILICA,10*10*0.6MM_GR | XXXXXXXXXX | 3120 | PCS | 41.53 | HONG KONG | CMA CGM LOGISTICS PARK ICD |
3/15/2024 | 39269099 | (HW/MB)CPU THERMAL SILICA,10*10*0.6MM_GR | XXXXXXXXXX | 930 | PCS | 12.38 | HONG KONG | CMA CGM LOGISTICS PARK ICD |
3/15/2024 | 85423900 | CPU 13*12.6*0.83MM HAWKEYE?SKU3?E6546N | XXXXXXXXXX | 2300 | PCS | 15304.64 | HONG KONG | CMA CGM LOGISTICS PARK ICD |