3/16/2024 | 85423200 | MOBILE-IC-MCP:MEMORY,KM8L9001JA-B624 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 1 | PCS | 25.17 | South Korea | DELHI AIR |
3/2/2024 | 85423200 | MOBILE PARTS-IC-MCP;MEMORY,KM2L9001CM,1108-000714 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 2 | NOS | 24.69 | South Korea | DELHI AIR |
3/2/2024 | 85423200 | MOBILE PARTS- IC-DDR5 SDRAM;K3KL4L40EM 1105-003243 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 1 | NOS | 31.1 | South Korea | DELHI AIR |
3/2/2024 | 85423200 | MOBILE PARTS-IC-POWER SUPERVISOR , S2MPS2 5, 1203-009606 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 1 | NOS | 2.72 | South Korea | DELHI AIR |
3/2/2024 | 85423200 | MOBILE PARTS-IC-MCP:MEMORY,MT29VZZZCDA1SKPR, 1108-000745 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 1 | NOS | 20.22 | South Korea | DELHI AIR |
12/28/2023 | 85423200 | A162-002214-256G SDSQU-256G LAMBEAUUP4-UMC 2D 1TBMABICS5 ASSEMBLED MEMORY DEVICE85 | SANDISK INDIA DEVICE DESIGN CENTRE PRIVATE LIMITED | 5 | NOS | 54.85 | South Korea | BANGALORE AIR |
11/23/2023 | 85423200 | IC-NOR FLASH;GD25LE64ELIGR,WLCSP,8P,TP,11107-002763 R/E (MOBILE PHONE PARTS) 7781683 DT: 11.09.2023 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 900 | PCS | 192.15 | South Korea | DELHI AIR CARGO ACC |
11/4/2023 | 85423200 | MOBILE PARTS- IC-MCP;MEMORY, H9QT0GECN6X145, 1108-000742 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 1 | NOS | 12.01 | South Korea | DELHI AIR CARGO ACC |
11/4/2023 | 85423200 | MOBILE PARTS- IC-DDR5 SDRAM;K3KL3L30CM-B, 1105-003213 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 2 | NOS | 24.02 | South Korea | DELHI AIR CARGO ACC |
11/4/2023 | 85423200 | MOBILE PARTS- IC-MCP;MEMORY, KM5L9002CM,1108-000714 | SAMSUNG INDIA ELECTRONICS PRIVATE LIMITED | 2 | NOS | 24.02 | South Korea | DELHI AIR CARGO ACC |