3/31/2024 | 85322990 | 2203-007486 C-CER,CHIP 1UF,10%,50V,X5R,TP,1608,-55TO (CAPACITOR FOR SAMSUNG MANUFACTURING) | SAMSUNG ELECTROMECHANICS CO LTD | 1200000 | PCS | 3689.07 | CHINA | DELHI AIR |
3/31/2024 | 85322990 | 16TQC100MYF CAP-POS CAP-100uF-10%-16V-50mOHM-S7343(D) | Powerline Technology Pte Ltd | 11762 | NOS | 4826.08 | CHINA | BANGALORE AIR |
3/31/2024 | 85322990 | SE1CAP012927 CAP CER C0G 0402 15PF 5% 50VDC (CAPACITOR) (IGCRD SR NO 14) | JABIL CIRCUIT SINGAPORE PTE LTD | 200000 | NOS | 161.59 | CHINA | SAHAR AIR |
3/31/2024 | 85322990 | MLCC 120pF/25V 01005 C0G 5% MURATA/GRM0225C1E121JA02L(1AG0-00G16AC\\\\\) Multi-Layer Ceramic Capacitor | PEGATRON CORPORATION | 380 | NOS | 0.28 | JAPAN | CHENNAI AIR |
3/31/2024 | 85322990 | MLCC 4.7uF/16V 0402 X5R 20% MURATA/GRM155R61C475ME11D(1A20-03QJ6AC\\\\\) Multi-Layer Ceramic Capacitor | PEGATRON CORPORATION | 30 | NOS | 0.13 | JAPAN | CHENNAI AIR |
3/31/2024 | 85322990 | 22CK1EC1050B MULTILAYER CERAMIC CHIP CAPACITOR (GRM155R61E105KA12D) (FOR MFG OF PCBA OF MOBILE PHONE) (CAPTIVE USE) | XIAOMI HK LIMITED | 25000 | NOS | 74.3 | CHINA | DELHI AIR |
3/31/2024 | 85322990 | 1220104000040A MULTILAYER CERAMIC CHIP CAPACITOR (GRM155R60J475ME87D) (FOR MFG OF PCBA OF MOBILE PHONE) (CAPTIVE USE) | XIAOMI HK LIMITED | 100000 | NOS | 136.76 | CHINA | DELHI AIR |
3/31/2024 | 85322990 | 1220104000040A MULTILAYER CERAMIC CHIP CAPACITOR (GRM155R60J475ME87D) (FOR MFG OF PCBA OF MOBILE PHONE) (CAPTIVE USE) | XIAOMI HK LIMITED | 1310000 | NOS | 1791.54 | CHINA | DELHI AIR |
3/31/2024 | 85322990 | 2203-007474 C-CER,CHIP 10UF,20%,6.3V,X5R,TP,1207,T0. (CAPACITOR FOR SAMSUNG MANUFACTURING) | SAMSUNG ELECTROMECHANICS CO LTD | 2400000 | PCS | 11803.29 | CHINA | DELHI AIR |
3/31/2024 | 85322990 | 2203-007474 C-CER,CHIP 10UF,20%,6.3V,X5R,TP,1207,T0. (CAPACITOR FOR SAMSUNG MANUFACTURING) | SAMSUNG ELECTROMECHANICS CO LTD | 2400000 | PCS | 11803.29 | CHINA | DELHI AIR |