3/30/2024 | 85423100 | IC mobile phone chips, used in research and development. Qualcomm brand. Model SM8650. 100% New | XXXXXXXXXX | 2 | PCE | 300.6 | South Korea | NA |
3/28/2024 | 85423100 | V0001238#&0664-014P0UU#Monolithic digital circuit board, no data storage security function#PMIC PMP-8074-0-112MSP-TR00001.NSX: QUALCOMM. New 100% | XXXXXXXXXX | 4000 | PCE | 5983.2 | China | NA |
3/28/2024 | 85423100 | V0001240#&023T-003Q0W3#Technical circuit board-chip set, no data storage security function#CS QFN-40.#NSX: QUALCOMM. New 100% | XXXXXXXXXX | 16000 | PCE | 9270.4 | China | NA |
3/28/2024 | 85423100 | V0001238#&0664-014P0UU#Monolithic digital circuit board, no data storage security function#PMIC PMP-8074-0-112MSP-TR00001.NSX: QUALCOMM. New 100% | XXXXXXXXXX | 4000 | PCE | 5983.2 | Taiwan | NA |
3/28/2024 | 85423100 | IC mobile phone chips, used in research and development. Qualcomm brand. Model SM8550. 100% New | XXXXXXXXXX | 2 | PCE | 279.1 | Brazil | NA |
3/28/2024 | 85423100 | V0001240#&023T-00NE0UU#Technical circuit board-chip set, no data storage security function#CS DRQFN-105.NSX: QUALCOMM. New 100% | XXXXXXXXXX | 8000 | PCE | 9827.2 | Taiwan | NA |
3/28/2024 | 85423100 | V0001240#&023T-00SD0W3#Technical circuit board-chip set#CS DRQFN-148.#NSX: QUALCOMM. New 100% | XXXXXXXXXX | 4000 | PCE | 6912.4 | Taiwan | NA |
3/28/2024 | 85423100 | V0001240#&023T-00BM0W3#Technical circuit board-chip set, without data storage security function#QUALCOMM/CSR8811A12-IQQD-R, Manufacturer: QUALCOMM. New 100% | XXXXXXXXXX | 12000 | PCE | 12585.6 | Taiwan | NA |
3/28/2024 | 85423100 | V0001240#&023T-00NC0UU#Technical circuit board-chip set, no data storage security function#CS DRQFN-105.NSX: QUALCOMM. New 100% | XXXXXXXXXX | 8000 | PCE | 10756 | Taiwan | NA |
3/27/2024 | 76169990 | Jig HFCSM-8875/SOM-Qualcomm depanel carrier/FU YU/Material :AL6061 Dimension : Base on actual PCBA, main material: Aluminum, 100% new, 2FSN-O10522, HFCSM-8875 | XXXXXXXXXX | 1 | PCE | 248.679 | Vietnam | NA |