| 3/28/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/27/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/26/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/26/2024 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains 90-99% water; Sulfuric acid 0.1-<1% (7664-93-9 ); 1-Propanesulfonic acid, 3,3'dithiobis-1-5% (27206-35-5); Copper sulfate 0.1-<1% (7758-98-7) | XXXXXXXXXX | 260 | LTR | 5488.834 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 200 | LTR | 4030 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 400 | LTR | 8060 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 200 | LTR | 4030 | Taiwan | NA |
| 3/22/2024 | 38249999 | CO-952098#&Hh preparation used for plating,CUPRACID 210 MAKE-UP,cas no:7664-93-9(Sulfuric acid);7758-98-7(Copper sulfate);27206-35-5(disodium 3, 3'-dithiobis[propanesulphonate]);7732-18-5(water(M.952098) | XXXXXXXXXX | 100 | KGM | 823.89 | China | NA |
| 3/22/2024 | 38249999 | CO-952100#&HC chemical preparation for plating CUPRACID 210 B, cas no:7664-93-9 (Sulfuric acid);7758-98-7(Copper sulfate);27206-35-5 (disodium 3.3' -dithiobis[propanesulphonate]);7732-18-5(water) (M.952100) | XXXXXXXXXX | 25 | KGM | 254.485 | China | NA |