| 3/30/2024 | 35069900 | SUPPER 8008 CLEAR,CEMEDINE Glue (135g/Tube) TP: Silicone modified polymer(60-70%), Fillers(30-40%), Aminosilane(1-5%), Organic tin compound(0.1-<1%), 100% new.#&CN | XXXXXXXXXX | 39150 | GRM | 3339.495 | VIETNAM | NA |
| 3/29/2024 | 35061000 | Glue used to glue electronic circuit boards - CEMEDINE SUPER X 8008 CLEAR. CAS code: 1120-21-4, 117-81-7. New 100% | XXXXXXXXXX | 40 | UNA | 755.768 | Japan | NA |
| 3/29/2024 | 35069900 | M0325#&Cemedine glue #AE-292 605-2 (3kg/bag) prepared, liquid, 100% new | XXXXXXXXXX | 18 | KGM | 673.2234 | Japan | NA |
| 3/28/2024 | 35061000 | Board glue - SUPER X NO.8008 BLACK NEO, 30 ml/Cartridge, Cemedine brand, 100% new | XXXXXXXXXX | 400 | PIP | 5800 | Japan | NA |
| 3/28/2024 | 35069190 | Plastic and rubber adhesive containing ethyl 2-cyanoactylate (CAS: 7085-85-0) (90-100%) CEMEDINE PPX SET #AC-110 (PPX 20g+ PRIMER PPX-3 40g) (60g/set) ,100% new | XXXXXXXXXX | 10 | SET | 138.709 | Japan | NA |
| 3/27/2024 | 35061000 | Silicone glue 8060 SR-048, 330ml/bottle, product code: 62-4887-40, Brand: Cemedine, 4 tubes/bag, 100% new product#&JP | XXXXXXXXXX | 4 | UNA | 60.9508 | Japan | NA |
| 3/27/2024 | 35069900 | CEMEDINE SX-720WH adhesive used to attach circuit boards (0.2kg/UNA), TP: n-Undecane 1120-21-4; Tetraethylsilicate 78-10-4; Inorganic filler; modified silicone polymer; calcium carbonate. 100% New | XXXXXXXXXX | 5 | UNA | 40.893 | Japan | NA |
| 3/27/2024 | 35061000 | VT0001#&Adhesive used to glue electronic circuit boards - CEMEDINE HIGH SUPER 5 (A) (B) (P/N: MARSGI0011). CAS code: 103-83-3, 80g/set, 3200g=40 sets | XXXXXXXXXX | 3200 | GRM | 540.16 | Japan | NA |
| 3/27/2024 | 35061000 | L1034# & Cemedine Super | XXXXXXXXXX | 380 | PCE | 5423.816 | Japan | NA |
| 3/26/2024 | 35061000 | Glue used to glue electronic circuit boards - CEMEDINE HIGH SUPER 5 (A)(B). CAS code: 103-83-3, 100% new product. Export from TKNK number: 106155425720 (March 21, 2024)#&JP | XXXXXXXXXX | 40 | SET | 540 | VIETNAM | NA |