| 3/30/2024 | 38249999 | 0#&HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can. 100% New | XXXXXXXXXX | 200 | LTR | 853.32 | South Korea | NA |
| 3/25/2024 | 29333990 | Chemical used in laboratories as analyte to check toxic residues in food samples 2,2-Bipyridyl CAS 366-18-7 Product code D216305-25G, 25g/bottle, 100% new product | XXXXXXXXXX | 1 | UNA | 45.3668 | India | NA |
| 3/25/2024 | 3824999990 | HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can. 100% new#&KR | XXXXXXXXXX | 200 | LTR | 853.32 | VIETNAM | NA |
| 3/25/2024 | 29333990 | Chemical used in laboratories as analyte to check toxic residues in food samples 2,2-Bipyridyl CAS 366-18-7 Product code D216305-50G, 50g/bottle, 100% new product | XXXXXXXXXX | 1 | UNA | 62.0354 | USA | NA |
| 3/20/2024 | 38249999 | = 0.1 -< 0.5%) USED IN Plating'>MM04-000155#&CHEMICAL PRINTOGANTH MV STABILIZER PLUS (CONTAINS Isopropyl alcohol >= 1 -< 1.5%, 2,2''-bipyridyl>= 0.1 -< 0.5%) USED IN Plating | XXXXXXXXXX | 300 | KGM | 2709 | South Korea | NA |
| 3/19/2024 | 38249999 | = 0.1 -< 0.5%) USED IN Plating'>MM04-000155#&CHEMICAL PRINTOGANTH MV STABILIZER PLUS (CONTAINS Isopropyl alcohol >= 1 -< 1.5%, 2,2''-bipyridyl>= 0.1 -< 0.5%) USED IN Plating | XXXXXXXXXX | 300 | KGM | 2709 | South Korea | NA |
| 3/4/2024 | 38249999 | = 0.1 -< 0.5%) USED IN Plating'>MM04-000155#&CHEMICAL PRINTOGANTH MV STABILIZER PLUS (CONTAINS Isopropyl alcohol >= 1 -< 1.5%, 2,2''-bipyridyl>= 0.1 -< 0.5%) USED IN Plating | XXXXXXXXXX | 100 | KGM | 903 | South Korea | NA |
| 3/4/2024 | 38249999 | = 0.1 -< 0.5%) USED IN Plating'>MM04-000155#&CHEMICAL PRINTOGANTH MV STABILIZER PLUS (CONTAINS Isopropyl alcohol >= 1 -< 1.5%, 2,2''-bipyridyl>= 0.1 -< 0.5%) USED IN Plating | XXXXXXXXXX | 100 | KGM | 903 | South Korea | NA |
| 2/29/2024 | 38249999 | 0#&HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can. 100% New | XXXXXXXXXX | 200 | LTR | 859.96 | South Korea | NA |
| 2/26/2024 | 3824999990 | HVF EL-Cu S H3: Copper plating solution contains 2,2'-Bipyridyl 0.5+/-0.4%, the remainder is water. 20l/can. 100% new#&KR | XXXXXXXXXX | 200 | LTR | 859.96 | VIETNAM | NA |