3/30/2024 | 39269069 | HANGER BOND NO : VIII/16/65/2023-2024-CPU-CBE BOE NO.2000113 BOE DT. 03/01/2024HANGER & SIZER : 3728.0001 80X2=360 842X | XXXXXXXXXX | 1022 | PCS | 70.87 | USA | TONDIAPET ICD |
3/30/2024 | 85045090 | REEXPORT OF POWER SUPPLY ? INTEL HIGH POWER GEN4 V4 TEST NEW TOOL KIT (Q6UJGEN4TURB),BOE NO:3764260/29.04.2021 | XXXXXXXXXX | 1 | NOS | 3526.25 | CANADA | CHENNAI AIR |
3/30/2024 | 85176990 | MOBILE PARTS:- ASSY KEY-INTEL;SM-N971N,KOR,BLACK LOCAL | XXXXXXXXXX | 1 | NOS | 0.48 | SRI LANKA | DELHI AIR |
3/30/2024 | 84733010 | CARD ASM, ADP O/T MAINBOARD, W/CPU, O/TLAPTOP, APP 70.0 WT 008166 SE SBC BRD 2RA272 US | XXXXXXXXXX | 1 | PCS | 5568.07 | AUSTRALIA | BANGALORE AIR |
3/30/2024 | 39269069 | HANGER BOND NO : VIII/16/65/2023-2024-CPU-CBE BOE NO.2000113 BOE DT. 03/01/2024HANGER & SIZER : 7968.000 3984X2=7968 | XXXXXXXXXX | 3984 | PCS | 473.59 | USA | TONDIAPET ICD |
3/30/2024 | 84733010 | CARD ASM, ADP, O/T MAINBOARD , W/CPU, O/T LAPTOP, APP<=70.0 WT 001877 SE SBC BRD2RA272 US | XXXXXXXXXX | 1 | PCS | 5515.41 | HONG KONG | BANGALORE AIR |
3/30/2024 | 85389000 | PARTS OF PANEL: CPU 315-2 DP | XXXXXXXXXX | 1 | NOS | 3835.37 | SAUDI ARABIA | DELHI AIR |
3/30/2024 | 85389000 | PARTS OF PANEL: S7 400 CPU 416 VS3.3 | XXXXXXXXXX | 1 | NOS | 7454.41 | SAUDI ARABIA | DELHI AIR |
3/30/2024 | 88079000 | GROUND POWER UNIT OPP 002955-SWIFTAIR HANGAR MADRID (MAD)-28VDC GPU ZMK-CPU-28-BDC CONVERTER (UNIT SL NO.5011) | XXXXXXXXXX | 1 | NOS | 12274.4 | SPAIN | BANGALORE AIR |
3/29/2024 | 84713010 | Samsung Galaxy Book3 , 13th Gen? Intel Core i7, 16 GB, 512GB , Win 11 Home , 15.6" , Graphite MADE IN china | XXXXXXXXXX | 15 | NOS | 12229.6 | RUSSIA | SAHAR AIR |