1/27/2024 | 84869042 | OF DIE ATTACH APPARATUS, TAPE AUTOMATED BONDERS, WIRE BONDER AND ECAPSULATION EQUIPMENT FOR ASSEMBLY OF SEMICONDUCTOR | XXXXXXXXXX | 1024 | Piece | 535 | Malaysia | SekupaNg |
1/20/2024 | 84869042 | OF DIE ATTACH APPARATUS, TAPE AUTOMATED BONDERS, WIRE BONDER AND ECAPSULATION EQUIPMENT FOR ASSEMBLY OF SEMICONDUCTOR | XXXXXXXXXX | 10 | Piece | 223 | Malaysia | SekupaNg |
1/5/2024 | 84869042 | OF DIE ATTACH APPARATUS, TAPE SEMICONDUCTORS, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR ASSEMBLY OF SEMICONDUCTORS | XXXXXXXXXX | 1 | Piece | 22102 | Malaysia | SekupaNg |