| 3/25/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature KE-G1250FC-TM7, 14mm*4.7g 211-220000-004H.new product 100% | XXXXXXXXXX | 900000 | GRM | 55800 | Japan | NA |
| 3/20/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature G311Q, 14mm * 6.3g 211-220000-005H. 100% new product | XXXXXXXXXX | 675000 | GRM | 52987.5 | China | NA |
| 3/20/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature GE-100LFCS10Z87, 14MM*4.7G 211-220000-017H.new item 100 % | XXXXXXXXXX | 100000 | GRM | 6800 | Japan | NA |
| 3/20/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature GE-100LFCS10Z87, 14MM*5.8G 211-220000-011H.new item 100 % | XXXXXXXXXX | 40000 | GRM | 2720 | Japan | NA |
| 3/18/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature EMEC-110K, 14mm*4.1g 0950080090033H.100% new product | XXXXXXXXXX | 30000 | GRM | 4236 | Japan | NA |
| 3/18/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature EMEC-110K, 14mm*4.5g 0950080090003A.100% new product | XXXXXXXXXX | 120000 | GRM | 16944 | Japan | NA |
| 3/18/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature EMEC-110K, 14mm *4.8g 0950080090044J. 100% new product | XXXXXXXXXX | 30000 | GRM | 4236 | Japan | NA |
| 3/14/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature KE-G1250FC-TM7, 14mm*4.7g 211-220000-004H.new product 100% | XXXXXXXXXX | 300000 | GRM | 18600 | Japan | NA |
| 3/8/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature EMEC-110K, 14mm*4.1g 0950080090033H.100% new product | XXXXXXXXXX | 30000 | GRM | 4236 | Japan | NA |
| 3/4/2024 | 32149000 | LXYZ0030#&A mixture of silica and epoxy resin in pellet form, which protects the chip after being melted and condensed at high temperature KE-G1250FC-TM7,14mm*4.7g,211-220000-004H,new 100%.Cas 60676-86-0 | XXXXXXXXXX | 795000 | GRM | 105735 | Japan | NA |