| 2/26/2024 | 29161410 | 0#&Molding powder used to test printed circuit boards, contains: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | UNA | 5187.3 | South Korea | NA |
| 12/27/2023 | 29161410 | 0#&Molding powder used to test printed circuit boards, contains: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | Bottle/Bottle/Tube | 5187 | South Korea | NA |
| 12/27/2023 | 29161410 | 0#&Molding powder used to test printed circuit boards, contains: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | Bottle/Bottle/Tube | 5187 | South Korea | NA |
| 8/17/2023 | 29161410 | 0#&Molding powder used to test printed circuit boards, contains: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder ver 2 (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | Bottle/Bottle/Tube | 5116.99 | South Korea | NA |
| 6/24/2023 | 29161410 | 0#&Molding powder for testing printed circuit boards, containing: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | Bottle/Bottle/Tube | 5116.992 | South Korea | NA |
| 4/19/2023 | 29161410 | 0#&Molding powder for testing printed circuit boards, containing: METHYL METHACRYLATE POLYMERIZED 99~100%(9011-14-7),Benzoyl Peroxide 1%<(94-36-0),2.9KGM/1UNA. (Acryl Mold Powder ver.2 (phi210*180)mm [CG020100004]) | XXXXXXXXXX | 40 | Bottle/Bottle/Tube | 5346.472 | South Korea | NA |